Monthly Archives: July 2013

Intel® 3D processor technology advances among industries

Posted on July 29, 2013 by admin

Based on the 22 nm Intel® 3D processor technology already used in the predecessor generation, the processors, formerly codenamed ‘Haswell’, have experienced a performance increase which will doubtlessly benefit applications. With improved processing and graphics performance as well as energy … Continue reading →

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A collaboration of embedded system integration

Posted on July 15, 2013 by admin

A collaboration among Virtium, Swissbit, and LiPPERT Embedded Computers working through the SFF-SIG resulted in a module with a pin definition that closely resembles that of a DDR3 standard DIMM. The pin definition leverages a high-performance 240-pin SMT connector system … Continue reading →

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Cost saving methods for embedded system

Posted on July 2, 2013 by admin

Cost is obviously a major deciding factor when selecting an embedded operating system. Since there is essentially no cost of goods with software, vendors can adjust their pricing model to generate revenue from various sources. Vendors can charge for an … Continue reading →

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